Press Release:

Sony Introduces Next Generation Cellular Surface Mounters

Press Release
News Article  February 2005


LAKE FOREST, Calif., Feb. 22 /PRNewswire/ -- Sony Manufacturing Systems America, Inc. (SMSA) today introduced its next generation of cellular surface mounter systems that feature a compact-sized design and boast a 40 percent increase in performance from previous models for high-speed and high-accuracy electronic chip mounting.

Sony's new F-series of cellular mounters includes the SI-F130 and SI-F209 models, which are expected to become available for sale in North America this spring.

"Our F-series mounter systems incorporate Sony's most advanced factory automation technology and can dramatically reduce mounting tact time to achieve fast turnaround and meet the increasing demands and high standards of the semiconductor industry," said Koh Nakata, president and CEO for SMSA.

The SI-F130 model is equipped with Sony's advanced planetary head, incorporating a new overlap mounting process that achieves a high placement tact time of 0.139 seconds and reduces cycle time by 20 percent when compared to the previous models. This model also features a newly developed PCB loading/unloading system that improves production performance and minimizes downtime by 40 percent over current models. With these added benefits built in a compact design, the SI-F130 model is ideal for handling 0402 chips.

                          SI-F130 Specifications

           Head Configuration               1 head & 12 nozzles
        Max. Mountable Cassettes    40 front & 40 rear on 8mm cassettes
           Mounting Tact Time                      0.139s
            Mounting Accuracy          +/- 0.06mm (Cpk 1.0 or better)
       Loading/Unloading Downtime                    0
               Dimensions                1,220Wx1,400Dx1,434H (mm)



The fine-pitch SI-F209 model uses improved speed with Sony's unique flying vision and nozzle changing systems, which reduce 20 percent of mounting cycle time compared to the previous models. It also utilizes the latest ejector-aided PCB loading/unloading system with advanced recognition technology, which enhances the ability to automatically generate image data for complex new parts.

                          SI-F209 Specifications

         Head Configuration                   1 head & 6 nozzles
      Max. Mountable Cassettes           40 cassettes on 8mm in front
                                             & 80 trays at the rear
         Mounting Tact Time                          0.49s
         Mounting Accuracy              +/- 0.05mm (Cpk 1.0 or better)
     Loading/Unloading Downtime                      0.6s
             Dimensions                    1,220Wx1,700Dx1,524H (mm)



"Our cellular mounters can handle both small-sized and large irregular-sized parts, enabling the production line to be adaptable and configurable as needed," Nakata added. "We can in turn provide customers with flexibility, as well as excellent production performance and economical efficiency to help them meet their strategic production plans and business goals."







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